collaborators

15 papers

cond-mat.supr-con2026

Gap reopening as a possible signature of coupling between Majorana zero modes in Sn-(Bi,Sb)2(Te,S)3-based Josephson trijunctions

Duolin Wang, Xiang Zhang, Yunxiao Zhang +21

In the past two decades, enormous efforts have been made to search for possible platforms and schemes to implement topological quantum computation (TQC). In exploring the Fu-Kane s…

cond-mat.mes-hall2026

Deterministic non-local parity control and supercurrent-based detection in an Andreev molecule

Shang Zhu, Xiaozhou Yang, Mingli Liu +15

The ability to manipulate and detect the parity of quantum states in superconductor-semiconductor hybrid systems is pivotal to realizing the promise of topological quantum computat…

cond-mat.mes-hall2025

Exchange operation of Majorana zero modes in topological insulator-based Josephson trijunctions

Yunxiao Zhang, Zhaozheng Lyu, Xiang Wang +19

Majorana zero modes are anyons obeying non-Abelian exchange statistics distinct from fermions or bosons. While significant progresses have been achieved in the past two decades in…

cond-mat.mes-hall2025

Intrinsic Non-linearity of Josephson Junctions as an Alternative Origin of the Missing First Shapiro Step

Lei Xu, Shuhang Mai, Manzhang Xu +15

The missing first Shapiro step in microwave-irradiated Josephson junctions has been widely interpreted as a hallmark of Majorana bound states. However, conventional mechanisms like…

quant-ph2025

Broad nonlocal spectrum in the Pb-InSb hybrid three terminals for potential realization of Kitaev chains

Guoan Li, Xiaofan Shi, Ruixuan Zhang +21

Hybrid superconductor-semiconductor(SC-SM) nanowires remain one of the foremost platforms for engineering topological superconductivity and Majorana zero modes(MZMs) towards fault-…

cond-mat.mes-hall2025

A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials

Zhongmou Jia, Yiwen Ma, Zhongchen Xu +18

Many materials with novel or exotic properties are highly sensitive to environmental factors such as air, solvents, and heat, which complicates device fabrication and limits their…