5 citations · 17 across the 7 of their papers we have counts for
5 papers · 1 filter
A More Flexible Realization of The SUNRED Algorithm
L. Pohl, V. Szekely
The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and developmen…
Reducing the Possibility of Subjective Error in the Determination of the Structure-Function-Based Effective Thermal Conductivity of Boards
E. Kollár, V. Szekely
The thermal response function given to a unit-step dissipation accurately characterizes the thermal system. Instead of the thermal response function the so-called structure functio…
Design issues of a variable thermal resistance
V. Szekely, G. Mezosi
Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated.…
Contactless Thermal Characterization Method of PCB-s Using Different IR Sensor Arrays
G. Bognár, V. Szekely, M. Rencz
In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the…
Thermal measurement and modeling of multi-die packages
A. Poppe, Y. Zhang, J. Wilson +3
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stac…