most citedThermal measurement and modeling of multi-die packages

5 citations · 17 across the 7 of their papers we have counts for

collaborators

7 papers

physics.gen-ph20082 cited

Improvements of the Variable Thermal Resistance

V. Szekely, S. Torok, E. Kollar

A flat mounting unit with electronically variable thermal resistance [1] has been presented in the last year [2]. The design was based on a Peltier cell and the appropriate control…

cs.OH20072 cited

Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

Gy. Bognar, V. Szekely, M. Rencz

In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the tempera…

cond-mat.mtrl-sci20073 cited

A More Flexible Realization of The SUNRED Algorithm

L. Pohl, V. Szekely

The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and developmen…

cond-mat.mtrl-sci2007

Reducing the Possibility of Subjective Error in the Determination of the Structure-Function-Based Effective Thermal Conductivity of Boards

E. Kollár, V. Szekely

The thermal response function given to a unit-step dissipation accurately characterizes the thermal system. Instead of the thermal response function the so-called structure functio…

cond-mat.mtrl-sci20074 cited

Design issues of a variable thermal resistance

V. Szekely, G. Mezosi

Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated.…

cond-mat.mtrl-sci20071 cited

Contactless Thermal Characterization Method of PCB-s Using Different IR Sensor Arrays

G. Bognár, V. Szekely, M. Rencz

In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the…