most citedThermal measurement and modeling of multi-die packages

5 citations · 17 across the 9 of their papers we have counts for

collaborators

9 papers

cs.OH2008

Contactless Thermal Characterization of High Temperature Test Chamber

Z. Szucs, G. Bognar, Vladimir Szekely +1

In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue…

cs.OH2008

Characterization and Modeling of an Electro-thermal MEMS Structure

P. G. Szabo, Vladimir Szekely

Thermal functional circuits are an interesting and perspectivic group of the MEMS elements. A practical realization is called Quadratic Transfer Characteristic (QTC) element which…

physics.gen-ph2008★ 2 cited

Improvements of the Variable Thermal Resistance

V. Szekely, S. Torok, E. Kollar

A flat mounting unit with electronically variable thermal resistance [1] has been presented in the last year [2]. The design was based on a Peltier cell and the appropriate control…

cs.OH2007★ 2 cited

Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

Gy. Bognar, V. Szekely, M. Rencz

In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the tempera…

cond-mat.mtrl-sci2007★ 3 cited

A More Flexible Realization of The SUNRED Algorithm

L. Pohl, V. Szekely

The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and developmen…

cond-mat.mtrl-sci2007

Reducing the Possibility of Subjective Error in the Determination of the Structure-Function-Based Effective Thermal Conductivity of Boards

E. Kollár, V. Szekely

The thermal response function given to a unit-step dissipation accurately characterizes the thermal system. Instead of the thermal response function the so-called structure functio…