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cond-mat.mes-hall2026
Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces
Jinwen Liu, Zifeng Huang, Lina Yang +10
Overheating is a critical bottleneck limiting the performance and reliability of next-generation high-power and high-frequency electronics. Interfacial thermal resistance constitut…
cond-mat.mes-hall2026
Thermal conductance across bonded SiOx-SiOx interfaces in hybrid bonding process
Xingqiang Zhang, Liu Chang, Liyi Li +1
Hybrid bonding is a pivotal technology for enabling three dimensional integrated circuits. Among the foremost challenges facing 3D IC implementation is thermal management, where a…