6 papers
Ultrahigh Thermal Conductivity in Isotopically Ultrapure Single-Crystal Diamond
Jinwen Liu, Junliang Fan, Zifeng Huang +1
Diamond has the highest thermal conductivity among natural materials. Reducing isotope scattering can further push the limit of thermal conductivity of diamond. Here, we report the…
Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements
Zifeng Huang, Yiyang Sun, Tianyu Jia +2
The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (\k{appa}) modeling framework. Howev…
High Thermal Conductivity of Back-End-of-Line Compatible Diamond Films
Jinwen Liu, Chufei Cheng, Feifei Tan +6
Back-end-of-line (BEOL) thermal management requires electrically insulating heat-spreading dielectric that can be integrated within thermal budgets below 400 C. Here, we report pol…
Active Passivation Tunes Hotspot Locations in GaN Transistors with In Situ Thermal Mechanical Visualization
Yicheng Wei, Sihang Liu, Zimu Jiang +6
Efficient thermal dissipation has become critical in emerging electronic devices. However, most existing studies have primarily focused on engineering heat dissipation pathways, la…
High Thermal Conductivity in Back-End-of-Line Compatible AlN Thin Films
Xufei Guo, Zirou Chen, Zifeng Huang +3
With thermal issues becoming a major challenge to the development of integrated circuits (ICs), high-thermal-conductivity (high-TC) materials are gaining interest from both the ind…
Ultralow and Tunable Thermal Conductivity of Parylene C for Thermal Insulation in Advanced Packaging
Yicheng Wei, Han Xu, Xingqiang Zhang +2
Parylene C thin films have significant applications in advanced packaging of microelectronics. Their thermal properties are critical for thermal management of electronic devices. H…