10 citations · 30 across the 11 of their papers we have counts for
12 papers
Package Hermeticity Testing with Thermal Transient Measurements
Andras Vass-Varnai, M. Rencz
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are expose…
Contactless Thermal Characterization of High Temperature Test Chamber
Z. Szucs, G. Bognar, Vladimir Szekely +1
In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue…
A novel method for fatigue testing of MEMS devices containing movable elements
Z. Szucs, M. Rencz
In this paper we present an electronic circuit for position or capacitance estimation of MEMS electrostatic actuators based on a switched capacitor technique. The circuit uses a ca…
Ni-MH battery modelling for ambient intelligence applications
D. Szente-Varga, D. Horvath, M. Rencz
Mobile devices, like sensor networks and MEMS actuators use mobile power supplies to ensure energy for their operation. These are mostly batteries. The lifetime of the devices depe…
Comparison of Two Low-Power Electronic Interfaces for Capacitive Mems Sensors
G. Nagy, Z. Szucs, S. Hodossy +2
The paper discusses the importance and the issues of interfacing capacitive sensors. Two architectures applicable for interfacing capacitive sensors are presented. The first soluti…
Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers
Z. Szucs, G. Nagy, S. Hodossy +2
In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for…