10 citations · 12 across the 5 of their papers we have counts for
4 papers · 1 filter
Exploring binary intermetallics for advanced interconnect applications using ab initio simulations
Kiroubanand Sankaran, Kristof Moors, Jean-Philippe Soulié +2
The challenge of increasing copper (Cu) resistivity with diminishing Cu interconnect dimensions in complementary metal-oxide-semiconductor (CMOS) transistors, along with the impera…
CuAl films as Alternatives to Copper for Advanced Interconnect Metallization
Jean-Philippe Soulié, Kiroubanand Sankaran, Geoffrey Pourtois +3
CuAl thin films with have been studied as potential alternatives for the metallization of advanced interconnects. First-principles simulations were…
Selection of Alternative Local Interconnect Metals: Beyond Traditional Criteria Towards Sustainable and Secure Supply Chains
Lizzie Boakes, Lars-Åke Ragnarsson, Cédric Rolin +1
In response to aggressive scaling demands in semiconductor manufacturing and the growing need to apply sustainable practices, this paper presents a holistic sustainability assessme…
AlSc thin films for advanced interconnect applications
Jean-Philippe Soulié, Kiroubanand Sankaran, Valeria Founta +7
AlSc thin films have been studied with compositions around AlSc ( = 0.75) for potential interconnect metallization applications. As-deposited 25 nm thick films w…