Cu${}_x$Al${}_{1-x}$ films as Alternatives to Copper for Advanced Interconnect Metallization

Jean-Philippe Soulié, Kiroubanand Sankaran, Geoffrey Pourtois +3

Cu${}_x$Al${}_{1-x}$ thin films with $0.2\le x\le 0.7$ have been studied as potential alternatives for the metallization of advanced interconnects. First-principles simulations were…