10 citations · 15 across the 4 of their papers we have counts for
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cond-mat.supr-con2023★ 5 cited
Properties of Nb\_xTi\_{(1-x)}N thin films deposited on 300 mm silicon wafers for upscaling superconducting digital circuits
Daniel Pérez Lozano, Jean-Philippe Soulié, Blake Hodges +7
Scaling superconducting digital circuits requires fundamental changes in the current material set and fabrication process. The transition to 300 mm wafers and the implementation of…
cond-mat.mtrl-sci2023★ 10 cited
AlSc thin films for advanced interconnect applications
Jean-Philippe Soulié, Kiroubanand Sankaran, Valeria Founta +7
AlSc thin films have been studied with compositions around AlSc ( = 0.75) for potential interconnect metallization applications. As-deposited 25 nm thick films w…