most citedDesign Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case Study

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cs.AR2026

AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits

Liton Kumar Biswas, Katayoon Yahyaei, Shajib Ghosh +5

Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management chall…