1 citations · 1 across the 2 of their papers we have counts for
2 papers
cs.AR2026
AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits
Liton Kumar Biswas, Katayoon Yahyaei, Shajib Ghosh +5
Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management chall…
eess.IV2026★ 1 cited
Design Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case Study
Katayoon Yahyaei, M Shafkat M Khan, Guillermo Cadima +2
The shift towards advanced packaging technologies, including 2.5D and 3D integration, addresses the limitations of traditional methods while meeting increasing demands for performa…