203 citations · 233 across the 4 of their papers we have counts for
Showing cond-mat.mtrl-sciShow all
3 papers · 1 filter
cond-mat.mtrl-sci2023★ 26 cited
Tuning the Interlayer Microstructure and Residual Stress of Buffer-Free Direct Bonding GaN/Si Heterostructures
Yan Zhou, Shi Zhou, Shun Wan +8
The direct integration of GaN with Si can boost great potential for low-cost, large-scale, and high-power device applications. However, it is still challengeable to directly grow G…
cond-mat.mtrl-sci2022★ 1 cited
Selective Direct Bonding of High Thermal Conductivity 3C-SiC Film to \b{eta}-Ga2O3 for Top-Side Heat Extraction
Jianbo Liang, Hiromu Nagai, Zhe Cheng +8
beta-Ga2O3 is a wide bandgap semiconductor with electrical properties better than SiC and GaN which makes it promising for applications of next-generation power devices. However, t…
cond-mat.mtrl-sci2022★ 203 cited
High Thermal Conductivity in Wafer Scale Cubic Silicon Carbide Crystals
Zhe Cheng, Jianbo Liang, Keisuke Kawamura +7
High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as either active functional materials or thermal managem…