203 citations · 233 across the 4 of their papers we have counts for
4 papers
Interfacial reaction boosts thermal conductance of room-temperature integrated semiconductor interfaces stable up to 1100 C
Zhe Cheng, Xiaoyang Ji, Zifeng Huang +7
Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandga…
Tuning the Interlayer Microstructure and Residual Stress of Buffer-Free Direct Bonding GaN/Si Heterostructures
Yan Zhou, Shi Zhou, Shun Wan +8
The direct integration of GaN with Si can boost great potential for low-cost, large-scale, and high-power device applications. However, it is still challengeable to directly grow G…
Selective Direct Bonding of High Thermal Conductivity 3C-SiC Film to \b{eta}-Ga2O3 for Top-Side Heat Extraction
Jianbo Liang, Hiromu Nagai, Zhe Cheng +8
beta-Ga2O3 is a wide bandgap semiconductor with electrical properties better than SiC and GaN which makes it promising for applications of next-generation power devices. However, t…
High Thermal Conductivity in Wafer Scale Cubic Silicon Carbide Crystals
Zhe Cheng, Jianbo Liang, Keisuke Kawamura +7
High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as either active functional materials or thermal managem…