7 citations · 7 across the 3 of their papers we have counts for
3 papers
A correlation of structural changes with nanomechanical properties in TiN-AlN multilayer films
Nidhin George Mathews, Aidan A. Taylor, Johannes Zechner +5
The present work investigates the changes in overall nanomechanical properties of reactively sputtered TiN-AlN multilayer films arising due to phase transformation in the AlN layer…
Capturing the dynamics of Ti diffusion across TiW/Cu heterostructures using X-ray photoelectron spectroscopy
Curran Kalha, Pardeep K. Thakur, Tien-Lin Lee +4
Interdiffusion phenomena between adjacent materials are highly prevalent in semiconductor device architectures and can present a major reliability challenge for the industry. To fu…
Evaluation of the Thermal Stability of TiW/Cu Heterojunctions Using a Combined SXPS and HAXPES Approach
Curran Kalha, Michael Reisinger, Pardeep. K. Thakur +7
Power semiconductor device architectures require the inclusion of a diffusion barrier to suppress, or at best prevent the interdiffusion between the copper metallisation interconne…