3 citations · 4 across the 3 of their papers we have counts for
3 papers
STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration
Varun Darshana Parekh, Zachary Wyatt Hazenstab, Srivatsa Rangachar Srinivasa +3
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous syste…
ALL-MASK: A Reconfigurable Logic Locking Method for Multicore Architecture with Sequential-Instruction-Oriented Key
Jianfeng Wang, Zhonghao Chen, Jiahao Zhang +9
Intellectual property (IP) piracy has become a non-negligible problem as the integrated circuit (IC) production supply chain is becoming increasingly globalized and separated that…
Application-driven Design Exploration for Dense Ferroelectric Embedded Non-volatile Memories
Mohammad Mehdi Sharifi, Lillian Pentecost, Ramin Rajaei +8
The memory wall bottleneck is a key challenge across many data-intensive applications. Multi-level FeFET-based embedded non-volatile memories are a promising solution for denser an…