most citedUtilizing Generative Adversarial Networks for Image Data Augmentation and Classification of Semiconductor Wafer Dicing Induced Defects

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cs.CV2024★ 1 cited

Utilizing Generative Adversarial Networks for Image Data Augmentation and Classification of Semiconductor Wafer Dicing Induced Defects

Zhining Hu, Tobias Schlosser, Michael Friedrich +3

In semiconductor manufacturing, the wafer dicing process is central yet vulnerable to defects that significantly impair yield - the proportion of defect-free chips. Deep neural net…