101 citations · 416 across the 10 of their papers we have counts for
11 papers
SC-1 Etching of Niobium and Titanium Nitride Thin Films
Adrián Gutiérrez-Cruz, K. A. C. Rathnathilaka, Jani M. Taskinen +6
Dry etching techniques, ubiquitous in microelectronics fabrication, often result in challenging levels of undesired collateral plasma-induced damage. In this work, we demonstrate a…
Experimentally verified, fast analytic and numerical design of superconducting resonators in flip-chip architectures
Hang-Xi Li, Daryoush Shiri, Sandoko Kosen +10
In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated ar…
Transmon qubit readout fidelity at the threshold for quantum error correction without a quantum-limited amplifier
Liangyu Chen, Hang-Xi Li, Yong Lu +17
High-fidelity and rapid readout of a qubit state is key to quantum computing and communication, and it is a prerequisite for quantum error correction. We present a readout scheme f…
Qubit-compatible substrates with superconducting through-silicon vias
K. Grigoras, N. Yurttagül, J. -P. Kaikkonen +21
We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million…
Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor
Sandoko Kosen, Hang-Xi Li, Marcus Rommel +24
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are…
Microkelvin electronics on a pulse-tube cryostat with a gate Coulomb blockade thermometer
Mohammad Samani, Christian P. Scheller, Nikolai Yurttagül +8
Access to lower temperatures has consistently enabled scientific breakthroughs. Pushing the limits of \emph{on-chip} temperatures deep into the microkelvin regime would open the do…