11 citations · 34 across the 8 of their papers we have counts for
4 papers · 1 filter
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models
Thorben Casper, Herbert De Gersem, Sebastian Schöps
Starting from a 3D electrothermal field problem discretized by the Finite Integration Technique, the equivalence to a circuit description is shown by exploiting the analogy to the…
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries
Thorben Casper, Herbert De Gersem, Renaud Gillon +4
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Tech…
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decompositions
D. Loukrezis, U. Römer, T. Casper +2
The temperature developed in bondwires of integrated circuits (ICs) is a possible source of malfunction, and has to be taken into account during the design phase of an IC. Due to m…
Determination of Bond Wire Failure Probabilities in Microelectronic Packages
Thorben Casper, Ulrich Römer, Sebastian Schöps
This work deals with the computation of industry-relevant bond wire failure probabilities in microelectronic packages. Under operating conditions, a package is subject to Joule hea…