11 citations · 34 across the 8 of their papers we have counts for
8 papers
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements
Katrin Hirmer, Thorben Casper, Sebastian Schöps +1
This paper proposes 3D field simulation models for different designs of integrated bond wire on-chip inductors. To validate the simulation models, prototypes for three designs with…
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique
Alexander Krimm, Thorben Casper, Sebastian Schöps +2
The proper generalized decomposition is applied to a static electrothermal model subject to uncertainties. A reduced model that circumvents the curse of dimensionality is obtained.…
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging
Thorben Casper, Ulrich Römer, Sebastian Schöps +1
This work addresses the simulation of heat flow and electric currents in thin wires. An important application is the use of bond wires in microelectronic chip packaging. The heat d…
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems
Thorben Casper, David Duque, Sebastian Schöps +1
We present a method for the automatic generation of netlists describing general three-dimensional electrothermal and electromagnetic field problems. Using a pair of structured orth…
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models
Thorben Casper, Herbert De Gersem, Sebastian Schöps
Starting from a 3D electrothermal field problem discretized by the Finite Integration Technique, the equivalence to a circuit description is shown by exploiting the analogy to the…
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries
Thorben Casper, Herbert De Gersem, Renaud Gillon +4
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Tech…