72 citations · 206 across the 7 of their papers we have counts for
7 papers
First principles evaluation of fcc ruthenium for use in advanced interconnects
Timothy M. Philip, Nicholas A. Lanzillo, Tue Gunst +4
As the semiconductor industry turns to alternate conductors to replace Cu for future interconnect nodes, much attention as been focused on evaluating the electrical performance of…
Topology and Observables of the Non-Hermitian Chern Insulator
Mark R. Hirsbrunner, Timothy M. Philip, Matthew J. Gilbert
Topology plays a central role in nearly all disciplines of physics, yet its applications have so far been restricted to closed, lossless systems in thermodynamic equilibrium. Given…
Loss of Hall Conductivity Quantization in a Non-Hermitian Quantum Anomalous Hall Insulator
Timothy M. Philip, Mark R. Hirsbrunner, Matthew J. Gilbert
Recent work has extended topological band theory to open, non-Hermitian Hamiltonians, yet little is understood about how non-Hermiticity alters the topological quantization of asso…
Theory of AC quantum transport with fully electrodynamic coupling
Timothy M. Philip, Matthew J. Gilbert
With the continued scaling of microelectronic devices along with the growing demand of high-speed wireless telecommunications technologies, there is increasing need for high-freque…
High-performance nanoscale topological energy transduction
Timothy M. Philip, Matthew J. Gilbert
The realization of high-performance, small-footprint, on-chip inductors remains a challenge in radio-frequency and power microelectronics, where they perform vital energy transduct…
Topological superconductivity in an ultrathin, magnetically-doped topological insulator proximity coupled to a conventional superconductor
Youngseok Kim, Timothy M. Philip, Moon Jip Park +1
As a promising candidate system to realize topological superconductivity, the system of a 3D topological insulator (TI) grown on top of the s-wave superconductor has been extensive…
Performance of Topological Insulator Interconnects
Timothy M. Philip, Mark R. Hirsbrunner, Moon Jip Park +1
The poor performance of copper interconnects at the nanometer scale calls for new material solutions for continued scaling of integrated circuits. We propose the use of three dimen…