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F. La Via

6 papers hereh-index 181.4k citations152 works total

Matching runs newest-first, so older work may not be attached to this profile yet.

author position
  • middle author5
  • last author1

Across the 6 of 6 papers where every author was matched, so the position is known.

fields
  • cond-mat.mtrl-sci3
  • physics.app-ph2
  • nucl-ex1
same name
  • F. La Via — 1 paper, h 2

Either other researchers who publish under this name, or the same person where the external sources have not merged their records.

identity via Semantic Scholar / OpenAlex

activity
20112021
most citedImpact of stacking faults and domain boundaries on the electronic transport in cubic silicon carbide probed by conductive atomic force microscopy

26 citations · 57 across the 6 of their papers we have counts for

collaborators
Showing physics.app-phShow all

2 papers · 1 filter

physics.app-ph2020★ 26 cited

Impact of stacking faults and domain boundaries on the electronic transport in cubic silicon carbide probed by conductive atomic force microscopy

F. Giannazzo, G. Greco, S. Di Franco +8

In spite of its great promises for energy efficient power conversion, the electronic quality of cubic silicon carbide (3C-SiC) on silicon is currently limited by the presence of a…

physics.app-ph2020★ 21 cited

Ohmic contacts on n-type and p-type cubic silicon carbide (3C-SiC) grown on silicon

Monia Spera, Giuseppe Greco, Raffaella Lo Nigro +5

This paper is a report on Ohmic contacts on n-type and p-type type cubic silicon carbide (3C-SiC) layers grown on silicon substrates. In particular, the morphological, electrical a…

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