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Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D…
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of pre…
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Metal inter-layer via (MIV) in Monolithic three-dimensional integrated circuits (M3D-IC) is used to connect inter-layer devices and provide power and clock signals across multiple…