activity
20202026
most citedAn Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits

2 citations · 2 across the 5 of their papers we have counts for

collaborators

5 papers

cs.AR2026

Monolithic 3D Integration for Null Convention Logic (NCL)-Based Asynchronous Circuits

Xiameng Zhang, Kushal Ponugoti, Ashiq Sakib +1

As the demand for high-speed and low-power electronics continues to grow, the quasi-delay-insensitive (QDI) asynchronous domain of digital design has emerged as a promising alterna…

eess.SY2023

Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration

Madhava Sarma Vemuri, Umamaheswara Rao Tida

Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D…

eess.SY2023

FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration

Madhava Sarma Vemuri, Umamaheswara Rao Tida

Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of pre…

eess.SY2023

Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration

Madhava Sarma Vemuri, Umamaheswara Rao Tida

Metal inter-layer via (MIV) in Monolithic three-dimensional integrated circuits (M3D-IC) is used to connect inter-layer devices and provide power and clock signals across multiple…

eess.SY2020★ 2 cited

An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits

Dawei Li, Madhava Sarma Vemuri, Umamaheswara Rao Tida

Low-power quadrature voltage-controlled oscillator (QVCO) design utilizing transformer-feedback and current-reuse techniques with increased frequency range is proposed in this pape…