most citedStack up your chips: Betting on 3D integration to augment Moore's Law scaling

10 citations · 16 across the 4 of their papers we have counts for

collaborators

5 papers

cs.LG20206 cited

Net2: A Graph Attention Network Method Customized for Pre-Placement Net Length Estimation

Zhiyao Xie, Rongjian Liang, Xiaoqing Xu +3

Net length is a key proxy metric for optimizing timing and power across various stages of a standard digital design flow. However, the bulk of net length information is not availab…

cs.LG2020

Fast IR Drop Estimation with Machine Learning

Zhiyao Xie, Hai Li, Xiaoqing Xu +2

IR drop constraint is a fundamental requirement enforced in almost all chip designs. However, its evaluation takes a long time, and mitigation techniques for fixing violations may…

cs.AR2020

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

Rahul Mathur, Chien-Ju Chao, Rossana Liu +6

3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integrat…

cs.AR202010 cited

Stack up your chips: Betting on 3D integration to augment Moore's Law scaling

Saurabh Sinha, Xiaoqing Xu, Mudit Bhargava +3

3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D…

cs.AR2018

Standard Cell Library Design and Optimization Methodology for ASAP7 PDK

Xiaoqing Xu, Nishi Shah, Andrew Evans +3

Standard cell libraries are the foundation for the entire backend design and optimization flow in modern application-specific integrated circuit designs. At 7nm technology node and…