48 citations · 164 across the 10 of their papers we have counts for
10 papers
Observation of coherently modulated thermal phonon band and lifetime in superlattice
Yuxuan Liao, Hiroshi Uchiyama, Naomi Nagai +12
Manipulating phonon band structures through wave interference in artificial periodic nanostructures is of fundamental interest and forms the foundation of phonon band engineering.…
Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface
Rulei Guo, Bin Xu, Fengwen Mu +1
SiC is a promising substrate for Si-on-insulator (SOI) wafers for efficient thermal management owing to its high thermal conductivity and large bandgap. However, fabricating a Si d…
Low thermal boundary resistance at bonded GaN/diamond interface by controlling ultrathin heterogeneous amorphous layer
Bin Xu, Fengwen Mu, Yingzhou Liu +3
Thermal boundary resistance (TBR) in semiconductor-on-diamond structure bottlenecks efficient heat dissipation in electronic devices. In this study, to reduce the TBR between GaN a…
Non-equilibrium Magnon Engineering Enabling Significant Thermal Transport Modulation
Takamasa Hirai, Toshiaki Morita, Subrata Biswas +13
Thermal conductivity, a fundamental parameter characterizing thermal transport in solids, is typically determined by electron and phonon transport. Although other transport propert…
Phase-transition-induced giant Thomson effect for thermoelectric cooling
Rajkumar Modak, Masayuki Murata, Dazhi Hou +7
The Seebeck and Peltier effects have been widely studied and used in various thermoelectric technologies, including thermal energy harvesting and solid-state heat pumps. However, b…
A Novel Strategy for GaN-on-Diamond Device with a High Thermal Boundary Conductance
Fengwen Mu, Bin Xu, Xinhua Wang +11
To achieve high device performance and high reliability for the gallium nitride (GaN)-based high electron mobility transistors (HEMTs), efficient heat dissipation is important but…