activity
20182021
most cited3D integration and packaging for solid-state qubits

35 citations · 52 across the 2 of their papers we have counts for

collaborators

6 papers

quant-ph202117 cited

Fabrication of superconducting through-silicon vias

Justin L. Mallek, Donna-Ruth W. Yost, Danna Rosenberg +15

Increasing circuit complexity within quantum systems based on superconducting qubits necessitates high connectivity while retaining qubit coherence. Classical micro-electronic syst…

quant-ph2020

Comparison of Dielectric Loss in Titanium Nitride and Aluminum Superconducting Resonators

Alexander Melville, Greg Calusine, Wayne Woods +8

Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial diel…

quant-ph2019

Solid-state qubits integrated with superconducting through-silicon vias

Donna-Ruth W. Yost, Mollie E. Schwartz, Justin Mallek +14

As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may re…

quant-ph201935 cited

3D integration and packaging for solid-state qubits

D. Rosenberg, S. Weber, D. Conway +9

Developing a packaging scheme that meets all of the requirements for operation of solid-state qubits in a cryogenic environment can be a formidable challenge. In this article, we d…

quant-ph2019

Microwave Packaging for Superconducting Qubits

Benjamin Lienhard, Jochen Braumüller, Wayne Woods +8

Over the past two decades, the performance of superconducting quantum circuits has tremendously improved. The progress of superconducting qubits enabled a new industry branch to em…

quant-ph2018

Determining interface dielectric losses in superconducting coplanar waveguide resonators

Wayne Woods, Greg Calusine, Alexander Melville +6

Superconducting quantum computing architectures comprise resonators and qubits that experience energy loss due to two-level systems (TLS) in bulk and interfacial dielectrics. Under…