Ion beam sputtering method for progressive reduction of nanostructures dimensions
arXiv:cond-mat/0311383 · doi:10.1007/s00339-004-2709-8
Abstract
An ion beam based dry etching method has been developed for progressive reduction of dimensions of prefabricated nanostructures. The method has been successfully applied to aluminum nanowires and aluminum single electron transistors (SET). The method is based on removal of material from the structures when exposed to energetic argon ions and it was shown to be applicable multiple times to the same sample. The electrical measurements and samples imaging in between the sputtering sessions clearly indicated that the dimensions, i.e. cross-section of the nanowires and area of the tunnel junctions in SET, were progressively reduced without noticeable degradation of the sample structure. We were able to reduce the effective diameter of aluminum nanowires from ~65 nm down to ~30 nm, whereas the tunnel junction area has been reduced by 40 %.
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Cited by in corpus (19)
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- Threefold enhancement of superconductivity and the role of field-induced odd-frequency pairing in epitaxial aluminum films near the 2D limit
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- Quantum size phenomena in single-crystalline bismuth nanostructures