Low crosstalk modular flip-chip architecture for coupled superconducting qubits

Abstract

We present a flip-chip architecture for an array of coupled superconducting qubits, in which circuit components reside inside individual microwave enclosures. In contrast to other flip-chip approaches, the qubit chips in our architecture are electrically floating, which guarantees a simple, fully modular assembly of capacitively coupled circuit components such as qubit, control, and coupling structures, as well as reduced crosstalk between the components. We validate the concept with a chain of three nearest neighbor coupled generalized flux qubits in which the center qubit acts as a frequency-tunable coupler. Using this coupler, we demonstrate a transverse coupling on/off ratio $\approx$ 50, zz-crosstalk $\approx$ 0.7 kHz between resonant qubits and isolation between the qubit enclosures > 60 dB.

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Cited by in corpus (2)

• Resource-Efficient Cross-Platform Verification with Modular Superconducting Devices
• Flexible Readout and Unconditional Reset for Superconducting Multi-Qubit Processors with Tunable Purcell Filters