HR-EBSD analysis of in situ stable crack growth at the micron scale
arXiv:2206.10243 · doi:10.1016/j.jmps.2022.105173
Abstract
Understanding the local fracture resistance of microstructural features. such as brittle inclusions, coatings, and interfaces at the microscale under complex loading conditions is critical for microstructure-informed design of materials. In this study, a novel approach has been formulated to decompose the J-integral evaluation of the elastic energy release rate to the three-dimensional stress intensity factors directly from experimental measurements of the elastic deformation gradient tensors of the crack field by in situ high (angular) resolution electron backscatter diffraction (HR-EBSD). An exemplar study is presented of a quasi-static crack, inclined to the observed surface, propagating on low index {hkl} planes in a (001) single crystal silicon wafer.
References in corpus (2)
Cited by in corpus (4)
- An iterative method for reference pattern selection in high resolution electron backscatter diffraction (HR-EBSD)
- Registration between DCT and EBSD datasets for multiphase microstructures
- In situ elucidation of mechanisms governing crack transition to plasticity arrest
- A Computational Method for the Determination of the Elastic Displacement Field using Measured Elastic Deformation Field