Creep failure in a threshold activated dynamics: Role of temperature during a sub-critical loading

Abstract

Creep is a time-dependent deformation of solids at relatively low stresses, leading to the breakdown with time. Here we propose a simple model for creep failure of disordered solids, in which temperature and stress are controllable. Despite its simplicity, this model can reproduce most experimental observations. Time dependence of the strain rate is well fitted with power laws resembling the Omori-Utsu and the inverse Omori laws in the primary and the tertiary creep regimes, respectively. Distribution of the creep lifetime obeys the log-normal distribution, and the average creep lifetime decays in a scale-free manner with the increasing stress. The above results are in good agreement with experiments. Additionally, the mean avalanche size as a function of temperature exhibits a series of jumps, and finite-size scaling implies the existence of phase transitions.

arXiv comment9 pages, 9 figures

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Cited by in corpus (2)

• Crack Localization and the Interplay between Stress Enhancement and Thermal Noise
• Creep failure in heterogeneous materials from the barrier landscape