Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC

Abstract

Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about $1$ $\times$ $10^{16}$ ${\text{n}}_{\text{eq}}$ cm${}^{-2}$ (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.

Conference Proceedings of VCI2019, 15th Vienna Conference of Instrumentation, February 18-22, 2019, Vienna, Austria. arXiv admin note: text overlap with arXiv:1903.01963

References in corpus (5)

• The DESY II Test Beam Facility
• Performance of the EUDET-type beam telescopes
• Radiation hardness of small-pitch 3D pixel sensors up to a fluence of $3\times 10^{16}$ n${}_{\mathrm{eq}}$/cm${}^2$
• First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1\times$$10^{16}$neq cm${}^{-2}$
• First study of small-cell 3D Silicon Pixel Detectors for the High Luminosity LHC

Cited by in corpus (3)

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• Pixelated 3D sensors for tracking in radiation harsh environments