Performance of Thin Planar \textit{n-on-p} silicon pixels after HL-LHC radiation fluences

Abstract

The tracking detector of ATLAS, one of the experiments at the Large Hadron Collider (LHC), will be upgraded in 2024-2026 to cope with the challenging environment conditions of the High Luminosity LHC (HL-LHC). The LPNHE, in collaboration with FBK and INFN, has produced 130~$\mu$m thick $n-on-p$ silicon pixel sensors which can withstand the expected large particle fluences at HL- LHC, while delivering data at high rate with excellent hit efficiency. Such sensors were tested on beam before and after irradiation both at CERN-SPS and at DESY, and their performances are presented in this paper. Beam test data indicate that these detectors are suited for all the layers where planar sensors are foreseen in the future ATLAS tracker: hit-efficiency is greater than 97\% for fluences $\Phi \lesssim 7\times 10^{15}{\mathrm{n}}_{\mathrm{eq}}/c{\mathrm{m}}^2$ and module power consumption is within the specified limits. Moreover, at a fluence $\Phi =1.3\times 10^{16}{\mathrm{n}}_{\mathrm{eq}}/c{\mathrm{m}}^2$, hit-efficiency is still as high as 88\% and charge collection efficiency is about 30\%.

arXiv comment24 pages, 14 figures, published version

References in corpus (8)

• Production and Integration of the ATLAS Insertable B-Layer
• Performance of the EUDET-type beam telescopes
• Design and Performance of the CMS Pixel Detector Readout Chip
• Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results
• The INFN-FBK Phase-2 R{\&}D Program
• Investigation of thin n-in-p planar pixel modules for the ATLAS upgrade
• Performance of active edge pixel sensors
• Thin and edgeless sensors for ATLAS pixel detector upgrade

Cited by in corpus (1)

• Temporal characterisation of silicon sensors on Timepix3 ASICs