Thermocompression Bonding Technology for Multilayer Superconducting Quantum Circuits

Abstract

Extensible quantum computing architectures require a large array of quantum devices operating with low error rates. A quantum processor based on superconducting quantum bits can be scaled up by stacking microchips that each perform different computational functions. In this article, we experimentally demonstrate a thermocompression bonding technology that utilizes indium films as a welding agent to attach pairs of lithographically-patterned chips. We perform chip-to-chip indium bonding in vacuum at $190^{\circ }C$ with indium film thicknesses of $150nm$. We characterize the dc and microwave performance of bonded devices at room and cryogenic temperatures. At $10mK$, we find a dc bond resistance of $515n\Omega m{m}^2$. Additionally, we show minimal microwave reflections and good transmission up to $6.8GHz$ in a tunnel-capped, bonded device as compared to a similar uncapped device. As a proof of concept, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our bonding technology can be used in quantum computing applications.

arXiv comment5 pages main, 3 figures and 1 table; 5 pages supplementary, 4 figures

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Cited by in corpus (4)

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• Thin film metrology and microwave loss characterization of indium and aluminum/indium superconducting planar resonators
• Mitigating coherent leakage of superconducting qubits in a large-scale quantum socket