Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die
arXiv:1205.2745 · doi:10.1016/j.scriptamat.2006.01.004
Abstract
A flow line function is proposed to describe the material deformation in ECAE for a 120\degree die. This new analytical approach is incorporated into a viscoplastic self-consistent polycrystal code to simulate the texture evolution in Route A of copper and compared to experimental textures as well as to those corresponding to simple shear.