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Universal Technology Corporation (United States)

United States

1 paper here134 citations across 1
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  • cond-mat.mtrl-sci1
ROR 04bssxt85OpenAlex

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most citedHow to Characterize Thermal Transport Capability of 2D Materials Fairly? - Sheet Thermal Conductance and the Choice of Thickness

134 citations

researchers with a paper here
  • Ajit K. Roy1
  • Jonghoon Lee1
  • Tengfei Luo1
  • Vikas Varshney1
  • Xufei Wu1
  • Yunsong Pang1
collaborating institutions
  • Universal Technical InstituteUS1 paper
  • University of Notre DameUS1 paper
  • Wright-Patterson Air Force BaseUS1 paper

1 paper

cond-mat.mtrl-sci2016★ 134 cited

How to Characterize Thermal Transport Capability of 2D Materials Fairly? - Sheet Thermal Conductance and the Choice of Thickness

Xufei Wu, Vikas Varshney, Jonghoon Lee +3

Ever since the discovery of the record-high thermal conductivity of single layer graphene, thermal transport capability of monolayer 2D materials has been under constant spotlight.…

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