58 citations
- Siemens (Austria)AT8 papers
- Graz University of TechnologyAT7 papers
- Infineon Technologies (Germany)DE7 papers
- TU WienAT6 papers
- Universität InnsbruckAT5 papers
- Alpine Quantum Technologies (Austria)AT3 papers
- ETH ZurichCH3 papers
- Institute for Quantum Optics and Quantum Information InnsbruckAT3 papers
- Johannes Gutenberg University MainzDE3 papers
- Johannes Kepler University of LinzAT3 papers
- Universität für Weiterbildung KremsAT3 papers
- University of ViennaAT3 papers
5 papers · 1 filter
Correlating on-the-fly Electrical and Optical Skyrmion Readout
Grischa Beneke, Kilian Leutner, Nikhil Vijayan +7
Magnetic skyrmions, topologically stabilized spin textures, are promising candidates for future memory devices and non-conventional computing applications due to their enhanced sta…
SOT Enabled 3D Magnetic Field Sensor with Low Offset and High Sensitivity
Sebastian Zeilinger, Johannes Güttinger, Klemens Prügl +10
In this work we demonstrate a spin-orbit torque (SOT) magnetic field sensor, designed as a Ta/CoFeB/MgO structure, with high sensitivity and capable of active offset compensation i…
A New View to Mission Profiles
Horst Lewitschnig, Marcus Mayrhofer, Peter Filzmoser
Mission profiles cover the conditions that a component, e.g., an electronic component of a vehicle, is exposed to during its lifecycle. Currently, these profiles typically provide…
Scalability of Reinforcement Learning Methods for Dispatching in Semiconductor Frontend Fabs: A Comparison of Open-Source Models with Real Industry Datasets
Patrick Stöckermann, Henning Südfeld, Alessandro Immordino +7
Benchmark datasets are crucial for evaluating approaches to scheduling or dispatching in the semiconductor industry during the development and deployment phases. However, commonly…
Test and characterization of multilayer ion traps on fused silica
Matthias Dietl, Marco Valentini, Fabian Anmasser +7
Ion traps are a promising architecture to host a future quantum computer. Several challenges, such as signal-routing, power dissipation, and fabrication quality need to be overcome…