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cs.AR2026
FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems
Yubo Hou, Sezin Kircali Ata, Gen Liang Lim +4
The placement of chiplets on a silicon interposer is a pivotal step in 2.5D system integration, yet existing placement approaches typically assume a pre-defined interposer footprin…
cs.AR2026
DSPE: An Energy-Efficient Edge Processor for DeepSeek Inference with MerkleTree-based Incremental Pruning, Multi-Stage Boothing Lookup and Dynamic Adaptive Posit Processing
Yuhan Zhang, Zhou Wang, Zhou Shu +8
In recent years, DeepSeek has achieved strong inference performance but remains hard to deploy on energy-constrained edge devices. This paper presents the DeepSeek Processing Eleme…