2 papers
physics.ins-det2025
A Spatial-Physics Informed Model for 3D Spiral Sample Scanned by SQUID Microscopy
J. Senthilnath, Jayasanker Jayabalan, Zhuoyi Lin +5
The development of advanced packaging is essential in the semiconductor manufacturing industry. However, non-destructive testing (NDT) of advanced packaging becomes increasingly ch…
eess.IV2025
3D Magnetic Inverse Routine for Single-Segment Magnetic Field Images
J. Senthilnath, Chen Hao, F. C. Wellstood
In semiconductor packaging, accurately recovering 3D information is crucial for non-destructive testing (NDT) to localize circuit defects. This paper presents a novel approach call…