2 papers
cs.ET2025
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
Yukai Chen, Massimiliano Di Todaro, Bjorn Vermeersch +5
Advances in nanosheet technologies have significantly increased power densities, exacerbating thermal management challenges in 2.5D/3D chiplet-based Systems-in-Package (SiP). While…
cs.ET2025
TAXI: Traveling Salesman Problem Accelerator with X-bar-based Ising Macros Powered by SOT-MRAMs and Hierarchical Clustering
Sangmin Yoo, Amod Holla, Sourav Sanyal +5
Ising solvers with hierarchical clustering have shown promise for large-scale Traveling Salesman Problems (TSPs), in terms of latency and energy. However, most of these methods sti…