2 papers
cond-mat.mes-hall2025
Accelerated Discovery of Topological Conductors for Nanoscale Interconnects
Alexander C. Tyner, William Rogers, Po-Hsin Shih +5
The sharp increase in resistivity of copper interconnects at ultra-scaled dimensions threatens the continued miniaturization of integrated circuits. Topological semimetals (TSMs) w…
cond-mat.mes-hall2025
Surface-dominant transport in Weyl semimetal NbAs nanowires for next-generation interconnects
Yeryun Cheon, Mehrdad T. Kiani, Yi-Hsin Tu +20
Ongoing demands for smaller and more energy efficient electronic devices necessitate alternative interconnect materials with lower electrical resistivity at reduced dimensions. Des…