STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration

Varun Darshana Parekh, Zachary Wyatt Hazenstab, Srivatsa Rangachar Srinivasa +3

Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous syste…