2 papers
eess.SY2025
3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems
Anirban Samanta, Shun-Hung Lee, Chun-Yi Cheng +2
3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Ba…
physics.optics2025
Mixed Precision Photonic Computing with 3D Electronic-Photonic Integrated Circuits
Georgios Charalampous, Rui Chen, Mehmet Berkay On +12
We propose advancing photonic in-memory computing through three-dimensional photonic-electronic integrated circuits using phase-change materials (PCM) and AlGaAs-CMOS technology. T…