2 papers
eess.SY2025
3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems
Anirban Samanta, Shun-Hung Lee, Chun-Yi Cheng +2
3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Ba…
eess.SY2024
High Performance Three-Terminal Thyristor RAM with a P+/P/N/P/N/N+ Doping Profile on a Silicon-Photonic CMOS Platform
Changseob Lee, Ikhyeon Kwon, Anirban Samanta +2
3T TRAM with doping profile (P+PNPNN+) is experimentally demonstrated on a silicon photonic platform. By using additional implant layers, this device provides excellent memory perf…