2 papers
cond-mat.mtrl-sci2025
Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects
Onurcan Kaya, Hyeongjoon Kim, Byeongkyu Kim +7
This study focuses on amorphous boron nitride (-BN) as a novel diffusion barrier for advanced semiconductor technology, particularly addressing the critical challenge of co…
cond-mat.mtrl-sci2025
Artificial Intelligence-Assisted Workflow for Transmission Electron Microscopy: From Data Analysis Automation to Materials Knowledge Unveiling
Marc Botifoll, Ivan Pinto-Huguet, Enzo Rotunno +17
(Scanning) transmission electron microscopy ((S)TEM) has significantly advanced materials science but faces challenges in correlating precise atomic structure information with the…