Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects

Onurcan Kaya, Hyeongjoon Kim, Byeongkyu Kim +7

This study focuses on amorphous boron nitride ($\hat{\mathrm{I}}\pm$-BN) as a novel diffusion barrier for advanced semiconductor technology, particularly addressing the critical challenge of co…