3 papers
cond-mat.mes-hall2025
Electron Tunneling Enhances Thermal Conductance through Metal-Insulator-Semiconductor Junctions
Yizhe Liu, Bo Sun
The presence of interfaces in semiconductor devices substantially hinders thermal transport, contributing disproportionately to the overall thermal resistance. However, approaches…
cond-mat.mtrl-sci2025
Effective reduction in thermal conductivity by high-density dislocations in SrTiO3
Jinxue Ding, Jiawen Zhang, Jinfeng Dong +5
Decreasing thermal conductivity is important for designing efficient thermoelectric devices. Traditional engineering strategies have focused on point defects and interface design.…
physics.flu-dyn2025
Two-Phase Boiling in a Replaceable Embedded Heat Sink for Ultra-High Heat Flux SiC Chip Cooling
Shasha Huo, Bo Sun
While Moore's Law has approached its physical limits lately, the high integration and miniaturisation of electronics have also brought another thermal failure obstacle. Previous st…