collaborators

1 paper

physics.ins-det2025

High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films

Haripriya Bangaru, Giovanni Calderini, Dominik Dannheim +5

Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although rel…