2 papers
physics.ins-det2025
High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films
Haripriya Bangaru, Giovanni Calderini, Dominik Dannheim +5
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although rel…
physics.ins-det2025
Laboratory and beam-test performance study of a 55m pitch iLGAD sensor bonded to a Timepix3 readout chip
Peter Svihra, Richard Bates, Justus Braach +5
This contribution reports on characterisation results of a large-area (2) small pitch (55m) inverse Low-Gain Avalanche Detector (iLGAD), bonded to a Timepix3 r…