3 papers
cs.AR2025
Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
Emad Haque, Pragnya Sudershan Nalla, Jeff Zhang +3
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-s…
cs.AR2025
Accelerating Electrostatics-based Global Placement with Enhanced FFT Computation
Hangyu Zhang, Sachin S. Sapatnekar
Global placement is essential for high-quality and efficient circuit placement for complex modern VLSI designs. Recent advancements, such as electrostatics-based analytic placement…
cs.AR2024
ML-based AIG Timing Prediction to Enhance Logic Optimization
Wenjing Jiang, Jin Yan, Sachin S. Sapatnekar
As circuit designs become more intricate, obtaining accurate performance estimation in early stages, for effective design space exploration, becomes more time-consuming. Traditiona…