2 papers
cs.AR2025
Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
Emad Haque, Pragnya Sudershan Nalla, Jeff Zhang +3
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-s…
cs.AR2025
MAHL: Multi-Agent LLM-Guided Hierarchical Chiplet Design with Adaptive Debugging
Jinwei Tang, Jiayin Qin, Nuo Xu +5
As program workloads (e.g., AI) increase in size and algorithmic complexity, the primary challenge lies in their high dimensionality, encompassing computing cores, array sizes, and…